Palo Alto, California - Silicon zoom and battery technology in mobile communication system in the way of great opportunities station major obstacle, said in his keynote address, an ARM implementation.
Segars Simon said, “silicon scaling will end at some point,” the tone of each year in the ARM physical IP division general manager of Hot Chips event. Importantly, there is a genuine need for a new battery technology.
He said, surveying a small part of a single nanometer in diameter and close to nanometer digital process technology of silicon atoms, “You can only scale so far, we need to, like other group III-V semiconductor materials.”
Difficult to provide production quality of extreme ultraviolet (EUV) lithography technology has created the problem. Today’s immersion system chip makers to use sophisticated dual-graphics technology, while waiting for their EUV, may be required for 14nm node.
You need to generate a 200-300 wafers per hour, and today’s EUV technology machines for about five wafers per hour can be done now, some have questioned whether the mainstream - a lot of research still need to enter it.
Need more performance and power consumption also contributed to the complexity of multiple power domains, and timing closure. However, ARM EXEC commitments, including the 2015 Cortex A15 processor completely across multiple CPU and GPU’s consistent progress.
Battery technology seems equally challenging, increasing only about 11% per year, far behind the pace of Moore’s Law. Even maintain, sluggish rate “will need some special materials such as silicon alloy or carbon nanotube battery is really rubbish,” he said.
On the other side of the barrier is a huge mobile opportunity. All figures are large, noting that last year 40 million mobile phone users market, sales of 280 million smart phones. Although the company has made unexpected progress in the future there are several issues and the future will not be like the past.